Method for manufacturing light emitting diode

ABSTRACT

A light emitting diode includes a first electrode, a second electrode, and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. The second electrode surrounds periphery of the epitaxial structure to reflect light from the epitaxial structure out from the top of the epitaxial structure. A method for manufacturing the light emitting diode is also presented. The light emitting diode and the method increase lighting efficiency of the light emitting diode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application of patent application Ser. No. 14/823,129, filed on Aug. 11, 2015, entitled “LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME”, assigned to the same assignee, which is based on and claims priority to Chinese Patent Application No. 201410441937.2 filed on Sep. 2, 2014, the contents of which are incorporated by reference herein.

FIELD

The subject matter relates to semiconductor structures, and particularly relates to a light emitting diode and manufacturing method thereof.

BACKGROUND

A traditional light emitting diode includes a light transmission substrate, an N-type semiconductor layer, an active layer, a P-type semiconductor layer, a P-type electrode and an N-type electrode. The P-type electrode is arranged on a surface of the P-type semiconductor layer and the N-type electrode is arranged on a surface of the N-type semiconductor layer. Part of light emitted from the active layer is reflected by the N-type electrode and the P-type electrode, which reduces lighting efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations of the present technology will now be described, by way of example only, with reference to the attached figures:

FIG. 1 is a cross-section view of a light emitting diode in accordance with a first exemplary embodiment of the present disclosure.

FIG. 2 is a cross-section view of a light emitting diode in accordance with a second exemplary embodiment of the present disclosure.

FIGS. 3-15 are cross-sectional views showing semi-finished light emitting diodes processed by different steps of a method for manufacturing a light emitting diode in accordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION

It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.

FIG. 1 shows a light emitting diode 100 of a first embodiment in the present disclosure.

Referring to FIG. 1, the light emitting diode 100 in the first embodiment includes a first electrode 10, a second electrode 20, and an epitaxial structure 30. The epitaxial structure 30 is arranged on the first electrode 10. The epitaxial structure 30 is electrically connected to the first electrode 10 and the second electrode 20. The second electrode 20 surrounds periphery of the epitaxial structure 30 and reflective materials can be coated on inner surfaces of the second electrode 20 to reflect light emitted from the epitaxial structure 30, to ensure emission out from top of the epitaxial structure 30.

The first electrode 10 includes a top surface 11, a bottom surface 12 opposite to the top surface 11, and side surfaces 13. Each side surface 13 connects the top surface 11 to the bottom surface 12. The first electrode 10 is light-reflective. Preferably, the first electrode 10 is made of Cr or Au or materials with reflecting property.

The epitaxial structure 30 is arranged on the top surface 11 of the first electrode 10. A diameter of the epitaxial structure 30 is larger than the diameter of the first electrode 10. The bottom of the epitaxial structure 30 is directly attached on the top surface 11 of the first electrode 10 to be electrically connected to the first electrode 10. The periphery of the epitaxial structure 30 extends over the side surfaces 13 of the first electrode 10. A vertical cross-section of the first electrode 10 and the epitaxial structure 30 is shaped as a letter T.

The epitaxial structure 30 includes a first semiconductor layer 31, an active layer 32, and a second semiconductor layer 33. The first semiconductor layer 31, the active layer 32, and the second semiconductor layer 33 are arranged on the first electrode 10 in that order. The first semiconductor layer 31 is directly attached on the top surface 11 of the first electrode 10 to electrically connect the epitaxial structure 30 to the first electrode 10. In this exemplary embodiment, the first semiconductor layer 31 is a P-GaN layer, the active layer 32 is a multiple quantum wells (MQWs) layer, and the second semiconductor layer 33 is an N-GaN layer.

The second electrode 20 includes a base 21 and an extension 22. The extension 22 extends upwardly from the top of the base 21. In this exemplary embodiment, the first electrode 10 is surrounded by the base 21, and the periphery of the epitaxial structure 30 is surrounded by the extension 22.

A width of the base 21 is greater than the width of the extension 22. In this exemplary embodiment, the extension 22 has a constant height. A thickness of the base 21 is almost the same as the thickness of the first electrode 10. Preferably, the top surface of the base 21 and the top surface 11 of the electrode 10 are coplanar, and the bottom surface of the base 21 and the bottom surface 12 of the electrode 10 are coplanar.

The base 21 and the first electrode 10 are spaced apart from each other, and a first annular groove 40 is defined therebetween. Preferably, the first annular groove 40 is filled with an insulating layer 41. The insulating layer 41 can be SiO₂, SiN_(x), or SU-8 resin. Preferably, the insulating layer 41 is SiO₂. Materials with reflecting property are coated on surfaces of the insulating layer 41 to reflect light.

The extension 22 extends upwardly along the periphery of the epitaxial structure 30. The whole periphery of the epitaxial structure 30 is surrounded by the extension 22. A bottom inner edge 221 of the extended 22 is spaced apart from the first semiconductor layer 31 and the active layer 32, therewith a second annular groove 50 is defined. The second annular groove 50 is surrounded by the bottom inner edge 221 of the extension 22, a peripheral lateral surface 311 of the first semiconductor layer 31, and a peripheral lateral surface 321 of the active layer 32. Preferably, the second annular groove 50 is filled with the insulating layer 41.

The second annular groove 50 is defined between the top surface of second electrode 20 and the bottom surface of the second semiconductor layer 33. Preferably, a depth D of the second annular groove 50 is equal to a sum of depths of the first semiconductor layer 31 and the active layer 32. In other exemplary embodiments, the depth D of the second annular groove 50 can be larger than the sum of depths of the first semiconductor layer 31 and the active layer 33, but smaller than a height H of the epitaxial structure 30.

The top inner edge 222 of the extension 22 is in direct contact with the second semiconductor layer 33 to electrically connect the second electrode 20 to the epitaxial structure 30. Preferably, a height of the extension 22 extending upwardly from the top of the base 21 is equal to the height H of the epitaxial structure 30, the top surface of the extension 22 and an outside surface 331 of the second semiconductor layer 33 being coplanar. In this exemplary embodiment, the outside surface 331 of the second semiconductor layer 33 is a top emitting surface of the light emitting diode 100.

Medial light emitted from the epitaxial structure 30 is emitted from top of the epitaxial structure 30 directly, and side light emitted from the epitaxial structure 30 is reflected by the second electrode 20 to also be emitted from top of the epitaxial structure 30. This is because the first electrode 10 of the light emitting diode 100 in the present disclosure is located at the bottom of the epitaxial structure 30 and the periphery of the epitaxial structure 30 is surrounded by the second electrode 20. Better lighting efficiency of the light emitting diode 100 is obtained.

Additionally, the first annular groove 40 and the second annular groove 50 are filled with the insulating layers 41. Light striking the bottom of the epitaxial structure 30 is reflected by the insulating layers 41 to emit out from top of the epitaxial structure 30. The light is prevented from being emitted out from the second annular groove 50, but is allowed to be emitted out from the top of the epitaxial structure 30, thereby improving light efficiency.

The light emitting diode 100 can also include a light transmission layer 60. In this exemplary embodiment, the light transmission layer 60 is configured on top of the extension 22 and the outside surface 331 of the second semiconductor layer 33. The light transmission layer 60 covers the top of the extension 22 and the outside surface 331 of the second semiconductor layer 33. The light transmission layer 60 is made of materials with good light transmission properties. The light transmission layer 60 can protect the epitaxial structure 30 from moisture and dust, and enhance mechanical strength. In this exemplary embodiment, the light transmission layer 60 can be a sapphire substrate.

The light emitting diode 100 can further include a protective layer 70. The protective layer 70 is extended from the top surface of the base 21 and along the periphery of the extension 22 of the second electrode 20. The protective layer 70 encloses the extension 22 and the light transmission layer 60.

The protective layer 70 is made of materials with good thermal conductivity and good light transmission properties. The protective layer 70 protects the light transmission layer 60 and the extension 22 of the second electrode 20 and enhances mechanical strength of the whole light emitting diode 100. Heat generated from the epitaxial structure 30 is transferred by the extension 22 of the second electrode 20 to the protective layer 70. The protective layer 70 is also able to dissipate heat.

FIG. 2 shows a light emitting diode 200 of a second embodiment in the present disclosure.

Referring to FIG. 2, compared with the light emitting diode 100 of the first embodiment, a difference is that the epitaxial structure 30 of the light emitting diode 200 of the second embodiment further includes a buffer layer 34. The buffer layer 34 is formed between the light transmission layer 60 and the second semiconductor layer 33. The buffer layer 34 further includes a cryo unalloyed GaN layer 341 and a pyro unalloyed GaN layer 342. The pyro unalloyed GaN layer 342 and the cryo unalloyed GaN layer 341 are configured on the second semiconductor layer 33 that order.

A method for manufacturing a light emitting diode is also provided in the present disclosure.

Referring from FIG. 3 to FIG. 15, the method for manufacturing the light emitting diode includes:

growing an epitaxial layer 20 b on a light transmission substrate 10 b; the epitaxial layer 20 b comprising at least a first semiconductor layer 21 b, an active layer 22 b and a second semiconductor layer 23 b that order from the top down;

defining a plurality of annular pits 301 b on the epitaxial layer 20 b; each annular pit 301 b penetrating through at least the first semiconductor layer 21 b and the active layer 22 b;

filling each annular pit 301 b with a corresponding insulating layer 40 b;

forming a plurality of individual epitaxial structures 100 b by etching parts of the epitaxial layer 20 b surrounding periphery of the annular pits 301 b; the epitaxial structures 100 b being spaced apart from each other and a corresponding channel 50 b being defined therebetween;

forming a plurality of conductive layers 60 b in the channels 50 b to be the second electrode 400 b; each conductive layer 60 b covering periphery of a corresponding epitaxial structure 100 b;

dividing the light transmission substrate 10 b to form a plurality of separate epitaxial structures 100 b;

forming a first electrode 300 b to form a light emitting diode 500.

Referring to FIG. 3, an epitaxial layer 20 b is grown on a light transmission substrate 10 b. The epitaxial layer 20 b includes at least a first semiconductor layer 21 b, an active layer 22 b and a second semiconductor layer 23 b that order from the top down. In this exemplary embodiment, the epitaxial layer 20 b can further include a buffer layer 24 b. The buffer layer 24 b is configured between the light transmission substrate 10 b and the second semiconductor layer 23 b to raise the grown quantity of the epitaxial layer 20 b. Preferably, the buffer layer 24 b includes a cryo unalloyed GaN layer 241 b and a pyro unalloyed GaN layer 242 b. The cryo unalloyed GaN layer 241 b is grown on the light transmission substrate 10 b and the pyro unalloyed GaN layer 242 b is grown on the cryo unalloyed GaN layer 241 b. In this exemplary embodiment, the first semiconductor layer 21 b is a P-GaN layer, the active layer 22 b is a multiple quantum wells (MQWs) layer, and the second semiconductor layer 23 b is an N-GaN layer.

Referring from FIG. 4 to FIG. 6, a plurality of annular pits 301 b are defined on the epitaxial layer 20 b. Each annular pit 301 b penetrates in at least the first semiconductor layer 21 b and the active layer 22 b.

Preferably, forming the annular pits 301 b includes:

A photoresist layer 30 b is formed on the epitaxial layer 20 b. Several through holes 300 b are defined on the photoresist layer 30 b. The through holes 300 b are spaced apart from each other. In this exemplary embodiment, each through hole 300 b is ring-shaped. Part surface of the first semiconductor layer 21 b of the epitaxial layer 20 b is exposed by the through holes 300 b. The photoresist layer 30 b is negative photoresist. The photoresist layer 30 b can be made of polyisoprene.

The epitaxial layer 20 b is etched downward along the through holes 300 b to form the annular pits 301 b. Each annular pit 301 b connects to a corresponding through hole 300 b. Each annular pit 301 b is extended downward in height direction of the epitaxial layer 20 b. Each annular pit 301 b penetrates through the photoresist layer 30 b, the first semiconductor layer 21 b and the active layer 22 b to expose the second semiconductor layer 23 b.

Referring to FIG. 7, each annular pit 301 b is filled with a corresponding insulating layer 40 b. Preferably, the insulating layer 40 b is introduced as SiO₂.

Referring from FIG. 8 to FIG. 10, a plurality of epitaxial structures 100 b are formed by etching parts of the epitaxial layer 20 b surrounding periphery of the annular pits 301 b. The epitaxial structures 100 b are spaced apart from each other and a corresponding channel 50 b is defined therebetween.

Preferably, forming the channels 50 b includes:

Referring to FIG. 8, the photoresist layer 30 b is removed.

Referring to FIG. 9, a plurality of new photoresist layers 30 b are formed on the epitaxial structures 100 b. Each photoresist layer 30 b covers a corresponding insulating layer 40 b and parts of the epitaxial layer 20 b surrounded by the corresponding insulating layer 40 b. A corresponding spacer region 320 b is defined between two adjacent photoresist layers 30 b. In this exemplary embodiment, each spacer region 320 b is ring-shaped.

Referring to FIG. 10, the epitaxial structures 100 b are formed by etching the epitaxial layer 20 b downward along the spacer regions 320 b. Each channel 50 b is defined between two adjacent epitaxial structures 100 b. Each channel 50 b is ring-shaped.

In this exemplary embodiment, each channel 50 b penetrates through the first semiconductor layer 21 b, the active layer 22 b, the second semiconductor layer 23 b and the buffer layer 24 b to bottom of the channels 50 b.

Referring from FIG. 11 to FIG. 12, a plurality of conductive layers 60 b are formed in the channels 50 b. Each conductive layer 60 b covers periphery of a corresponding epitaxial structure 100 b.

Preferably, forming the conductive layers 60 b includes:

Referring to FIG. 11, a plurality of photoresist layers 30 c are formed in the channels 50 b. Each epitaxial structure 100 b is surrounded by a corresponding photoresist layer 30 c. Each photoresist layer 30 c is spaced apart from a corresponding epitaxial structure 100 b. Preferably, a height of the photoresist layer 30 c is equal to that of the corresponding epitaxial structure 100 b. In this exemplary embodiment, material composing the photoresist layers 30 c is the same with material composing the photoresist layers 30 b.

Referring to FIG. 12, each conductive layer 60 b is formed between the corresponding photoresist layer 30 c and periphery of the corresponding epitaxial structure 100 b. Each conductive layer 60 b covers the periphery of the corresponding epitaxial structures 100 b and periphery of a corresponding insulating layer 40 b. Preferably, a height of each conductive layer 60 b is equal to that of the corresponding epitaxial structure 100 b.

Referring to FIG. 13 to FIG. 14, the light transmission substrate 10 b is divided to form a plurality of separate epitaxial structures 100.

Forming the separate epitaxial structures 100 includes:

Referring to FIG. 13, the photoresist layers 30 b and 30 c are removed to form a gap 70 b between two adjacent epitaxial structures 100.

Referring to FIG. 14, the epitaxial structures 100 are separated by cutting the light transmission substrate 10 b. In detail, the epitaxial structures 100 are reversed and the light transmission substrate 10 b can be cut along the gaps 70 b by laser light. In detail, the light transmission substrate 10 b is cut by laser light after the epitaxial structures 100 being reversed and placed on a blue adhesive tape 200 b.

Referring to FIG. 15, a first electrode 300 b and a second electrode 400 b are formed to form a light emitting diode 500.

Configuring the first electrode 300 b and the second electrode 400 b includes:

A metal layer is configured under the first semiconductor layer 21 b to form the first electrode 300 b. In some embodiments, the conductive layer 60 b can be the second electrode 400 b. In this exemplary embodiment, another metal layer is configured under the conductive layer 60 b. The metal layer and the conductive layer 60 b are coupled to be the second electrode 400 b.

Preferably, an annular slot 350 b is formed between the first electrode 300 b and the second electrode 400 b. The annular slot 350 can be filled with the insulted layer 40 b. The insulted layer 40 b is introduced as SiO2.

The method for manufacturing the light emitting diode further may include: forming a protective layer 70 (referring to FIG. 2). The protective layer 70 is located outside of the light emitting diode 500. The protective layer 70 encloses the light transmission substrate 10 b and the conductive layer 60 b. The protective layer 70 is made of materials with good thermal conductivity and good light transmission properties. Preferably, the protective layer 70 is made of AlN.

In the process of manufacturing the light emitting diode, because the second electrode 20/400 b surrounds the periphery of the epitaxial structures 30/100 b, side light from the epitaxial structure 30/100 b is reflected by the second electrode 20/400 b to emit out from the top of the light emitting diode 100/200/500, thereby improving light efficiency of the light emitting diode 100/200/500.

The embodiment shown and described above is only an example. Many details are often found in the art such as the other features of the light emitting diode. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims. 

What is claimed is:
 1. A method for manufacturing a light emitting diode, comprising: growing an epitaxial layer on a light transmission substrate; the epitaxial layer comprising at least a first semiconductor layer, an active layer and a second semiconductor layer that order from the top down; defining a plurality of annular pits on the epitaxial layer; each annular pit penetrating through at least the first semiconductor layer and the active layer; filling each annular pit with a corresponding insulating layer; forming a plurality of individual epitaxial structures by etching parts of the epitaxial layer surrounding periphery of the annular pits; the epitaxial structures being spaced apart from each other and a corresponding channel being formed therebetween; forming a plurality of conductive layers in the channels to be the second electrode; each conductive layer covering periphery of a corresponding epitaxial structure; dividing the light transmission substrate to form a plurality of separate epitaxial structures; and forming a first electrode to form a light emitting diode.
 2. The method for manufacturing a light emitting diode of claim 1, wherein forming the annular pits comprising: forming a photoresist layer on the epitaxial layer, a plurality of through holes being defined on the photoresist layer, each through hole being ring-shaped; and etching the epitaxial layer downward along the through holes to form the annular pits.
 3. The method for manufacturing a light emitting diode of claim 2, wherein the epitaxial layer is etched downward and penetrates through the first semiconductor layer and the active layer to expose the second semiconductor layer.
 4. The method for manufacturing a light emitting diode of claim 2, wherein forming the channels comprising: removing the photoresist layer; forming a plurality of new photoresist layers on the epitaxial structures; each new photoresist layer covering a corresponding insulating layer and parts of the epitaxial layer surrounded by the corresponding insulating layer, a corresponding spacer region being defined between the two adjacent new photoresist layers; and etching the epitaxial layer downward along the spacer regions to form the epitaxial structures, each channel being defined between the two adjacent epitaxial structures, bottom of the channels being occluded by the light transmission substrate.
 5. The method for manufacturing a light emitting diode of claim 4, wherein forming the conductive layers comprising: forming a plurality of photoresist layers in the channels, each epitaxial structure being surrounded by a corresponding photoresist layer and each photoresist layer being spaced apart from a corresponding epitaxial structure; and forming the conductive layer between the corresponding photoresist layer and periphery of the corresponding epitaxial structure; each conductive layer covering the periphery of the corresponding epitaxial structures and periphery of a corresponding insulating layer.
 6. The method for manufacturing a light emitting diode of claim 5, wherein a height of each conductive layer is equal to that of the corresponding epitaxial structure.
 7. The method for manufacturing a light emitting diode of claim 6, wherein forming the separate epitaxial structures comprising: removing the photoresist layers to form a gap between two adjacent epitaxial structures; and cutting the light transmission substrate along the gaps to form the separate epitaxial structures.
 8. The method for manufacturing a light emitting diode of claim 7, wherein the epitaxial structures are reversed before being incised.
 9. The method for manufacturing a light emitting diode of claim 1, wherein the first semiconductor layer directly contacts with and is electrically connected to the first electrode, and the second semiconductor layer is electrically connected to the second electrode.
 10. The method for manufacturing a light emitting diode of claim 1, wherein the second electrode comprises a base and an extension, and the extension extends upwardly from top surface of the base. 